| 键合银合金丝的制备 |
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| 引用本文： | 范红,马晓霞,刘希云,李玉芹,杜晋峰.键合银合金丝的制备[J].黄金,2017,38(1). |
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| 作者姓名： | 范红 马晓霞 刘希云 李玉芹 杜晋峰 |
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| 作者单位： | 1. 烟台招金励福贵金属股份有限公司;2. 神华国华(北京)电力研究院有限公司 |
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| 摘 要： | 介绍了银质量分数为94%~96%的银合金丝的制备过程,采用扫描电镜和体式显微镜观察了其表面形貌以及键合后的表面形貌,探讨了退火温度对力学性能的影响及弧长对电学性能的影响,确定了该键合银合金丝的力学性能标准,并与国外进口产品进行了对比。其结果表明,该键合银合金丝的力学性能、电学性能和键合性能良好。
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| 关 键 词： | 键合 银合金丝 制备 力学性能 电学性能 键合性能 |
Preparation of Ag alloy bonding wire |
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| Fan Hong,Ma Xiaoxia,Liu Xiyun,Li Yuqin,Du Jinfeng.Preparation of Ag alloy bonding wire[J].Gold,2017,38(1). |
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| Authors: | Fan Hong Ma Xiaoxia Liu Xiyun Li Yuqin Du Jinfeng |
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| Abstract: | This paper described the preparation process of Ag alloy bonding wire with 94 ％-96 ％ Ag.The surface microstructures before and after bonding were observed by scanning electron scope and stereomicroscope.The paper discussed the effect of annealing temperature on mechanical properties and the effect of arc length on electric properties,arrived at the mechanical performance standard of the silver alloy bonding wire,and compared it with imported products.The results show that the mechanical,electric and bonding properties are all good. |
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| Keywords: | bonding silver alloy bonding wire preparation mechanical property electric property bonding property |
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