固溶时效工艺对Cu-Ni-Co-Si合金组织和性能的影响

通过硬度和导电率的测量、光学显微镜和透射电镜(TEM),研究了固溶时效工艺对Cu-Ni-Co-Si合金组织和性能的影响。结果表明:经过950 ℃×30 min水淬+500 ℃×480 min随炉冷却后,Cu-Ni-Co-Si 合金得到良好的综合性能:硬度为243.55 HV3,导电率为42.24%IACS;添加少量的V有利于提高二次时效后合金的导电率,并且进行适当的一次时效对提高合金的导电率和硬度是有利的,可以使二次时效试样迅速获得良好的综合性能;Cu-Ni-Co-Si合金的主要强化相为盘状正交结构的δ-(Co,Ni)₂Si,过饱和固溶体析出的沉淀物均匀分布,但位错缠结始终存在,其中基体与析出相的位向关系为001]_m//110]_p, (010)_m //(001)_p。

Effect of solution and aging on microstructure and properties of Cu-Ni-Co-Si alloy

Effects of solution and aging on the properties and microstructure of Cu-Ni-Co-Si alloy were investigated by means of hardness and electrical conductivity measurement, optical microscope and transmission electron microscope (TEM). The results show that the Cu-Ni-Co-Si alloy has good comprehensive properties after solution treating at 950 ℃ for 30 min plus aging at 500 ℃ for 480 min, its hardness is 243.55 HV3, electrical conductivity is 42.24%IACS. A few vanadium is beneficial to improve the electrical conductivity of the alloy after two-step aging, and pre-aging is beneficial to improve the electrical conductivity and hardness of the alloy, so that the two-step aging specimen can quickly obtain good comprehensive properties. The main strengthening phases of the Cu-Ni-Co-Si alloy are δ-(Co, Ni)₂Si, and the orientation relationship between the matrix and the precipitate phase is 001]_m//110]_p, (010)_m //(001)_p.