| 用环境应力筛选试验研究SMT焊点可靠性 |
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| 引用本文： | 魏健.用环境应力筛选试验研究SMT焊点可靠性[J].电子工艺技术,2000,21(1):13-16. |
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| 作者姓名： | 魏健 |
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| 作者单位： | 中物院电子工程研究所四川绵阳 610003 |
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| 摘 要： | 结合实际ＳＭＴ混装组件印制板，阐述了ＳＭＴ混装组件失效的机理，介绍了环境应力筛选试验的情况和结果，对影响可靠性的各种因素进行了分析与总结，指出了环境应力筛选是保证ＳＭＴ混装组件产品可靠性的必要手段。
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| 关 键 词： | 环境应力筛选 可靠性 失效机理 |
| 文章编号： | 1001-3474(2000)01-0013-04 |
| 修稿时间： | 1999年8月3日 |
Inquiry of the Reliability of SMT Soldering Dot With Environmental Stress Screening |
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| WEI Jian.Inquiry of the Reliability of SMT Soldering Dot With Environmental Stress Screening[J].Electronics Process Technology,2000,21(1):13-16. |
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| Authors: | WEI Jian |
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| Abstract: | With reference of practical mixed assembly,this article illustrates the mechanism of invalidation of mixed assembly,introduces the situation and result of environmental stress screening test and gives analysis and summary to all the factors which influences the reliability,indicates that the stress screening is the necessary method to guarantee the reliability of the products. |
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| Keywords: | Environmental stress screening Reliability Mechanism of invalidation |
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