| 填充环氧树脂界面残余应力研究 Ⅱ.影响界面残余应力的因素 |
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| 引用本文： | 王洪冰,李善君,于同隐. 填充环氧树脂界面残余应力研究 Ⅱ.影响界面残余应力的因素[J]. 热固性树脂, 1993, 0(1) |
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| 作者姓名： | 王洪冰 李善君 于同隐 |
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| 作者单位： | 复旦大学，复旦大学，复旦大学 |
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| 摘 要： | 本文针对橡胶改性环氧树脂体系和玻璃珠改性环氧树脂体系,研究了影响界面残余应力的因素.填料的粒径不影响界面残余应力的测量.界面键合强弱的影响在两体系中不相同.
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STUDIES ON INTERFACIAL RESIDUAL STRESS OF FILLED EPOXY RESIN Ⅱ. EFFECT FACTORS OF INTERFACIAL RESIDUAL STRESS |
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| Abstract: | The factors were studied which had influence on the interfacial stress of rubber-modified epoxy resin system and glass-bead-modified epoxy resin system. The particle size of filler did not have influence on the residual interfacial stress. The strength of interfacial bonding showed different effect in the two systems. |
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