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Morphology,Electrical, and Rheological Properties of Silane‐Modified Silver Nanowire/Polymer Composites
Authors:Yi‐Hsiuan Yu  Chen‐Chi M Ma  Siu‐Ming Yuen  Chih‐Chun Teng  Yuan‐Li Huang  Ikai Wang  Ming‐Hsiung Wei
Affiliation:1. Department of Chemical Engineering, National Tsing‐Hua University, Hsin‐Chu 30043, Taiwan;2. Chemical Systems Research Division, Chung Shan Institute of Science and Technology, Tao Yuan 32546, Taiwan
Abstract:Electrically conducting films containing AgNws, hydrophilic and hydrophobic resins were prepared. FT‐IR reveals that the interface between the AgNws and epoxy could be successfully modified by APTES. XPS shows that the AgNws were attracted by hydrogen bonds of ? NH2 and ? NH? groups after APTES modification. SEM analysis shows that the AgNws were well dispersed in the resin. The AgNws were also blended with hydrophilic and acrylic resins, and the resulting blends were compared with AgNws/epoxy blends. Results show that AgNw/PVA‐resin films possess the lowest surface electrical resistance. The AgNw/PVA‐resin and silane‐modified AgNw/epoxy resin conductive films possess a similar electrical percolation threshold.
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Keywords:electrical properties  modification  morphology  nanocomposites  silver nanowires
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