Thermal and electrical behavior of polyimide/silica hybrid thin films

Silica‐containing polyimide films were prepared by sol‐gel technique using a poly(amic acid) and tetraethoxysilane. The poly(amic acid) was synthesized by solution polycondensation reaction of 4,4′‐oxydiphthalic anhydride with 2,6‐bis(3‐aminophenoxy)benzene and an aminosilane coupling agent, 3‐aminopropyltriethoxysilane. The properties of these films, such as water vapors sorption capacity, dynamic contact angles and contact angle hysteresis, thermal, and electrical behavior have been evaluated with respect to their structure. The polymer films exhibited good thermal stability having the initial decomposition temperature above 450°C, glass transition temperature in the range of 223?228°C, and low‐dielectric constant in the range of 2.64?3.16. Two subglass transitions, γ and β, were evidenced by dynamic mechanical analysis and dielectric spectroscopy. The surface morphology and the roughness were investigated by atomic force microscopy and scanning electron microscopy. POLYM. ENG. SCI., 2010. © 2009 Society of Plastics Engineers