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碳氮膜的沉积工艺及其结构研究
引用本文:付志强,顾子平,等.碳氮膜的沉积工艺及其结构研究[J].广东有色金属学报,2001,11(2):134-137.
作者姓名:付志强  顾子平
作者单位:[1]广州有色金属研究院材料表面工程技术研究开发中心,广东广州510651 [2]广州凯得控股有限公司,广东广州510730
基金项目:广东省自然科学基金项目 (95 0 734)
摘    要:以氨气为反应气体,用真空阴极电弧沉积法制备了CNx膜,研究了工艺参数对膜层的沉积速率,化学成分的影响及膜层结合状态,结果表明,沉积速率随着氨气分压的提高而下降,当氨气分压达到6.7Pa时将没有膜的沉积;CNx膜主要由碳和氮组成,降低真空系统的抽速,将反应气体导至靶面附近,提高氨气分压可以提高膜层中氮含量,氮是以化合态存在于膜层中。

关 键 词:电弧沉积  VCAD  氨气  增氮膜

Research on deposition and structure of CN_x films
FU Zhi qiang\,GU Zi\|ping\,YUAN Zhen hai\,DENG Qi sen\,LIN Song sheng\,ZHENG Jian hong\,DAI Da huang\.Research on deposition and structure of CN_x films[J].Journal of Guangdong Non-Ferrous Metals,2001,11(2):134-137.
Authors:FU Zhi qiang\  GU Zi\|ping\  YUAN Zhen hai\  DENG Qi sen\  LIN Song sheng\  ZHENG Jian hong\  DAI Da huang\
Affiliation:1. Research & Development Center for Materials & Surface Engineering Technique under Guangzhou Research Institute of Non f
Abstract:CN x films were fabricated with ammonia as reactive gas by means of vacuum cathodic arc deposition method; the effect of deposition parameters on deposition rates and chemical composition in CN x coatings was studied and chemical bond status of CN x coatings was also analyzed.It was showed that the deposition rate of CN x films decreased with the increase of ammonia partial pressure; the coatings were mainly composed of C and N,and N content in CN x could be increased by decreasing pumping rate of vacuum system, guiding ammonia to the surroundings of the target and increasing ammonia partial pressure; nitrogen existed in the coatings in chemical bond status.
Keywords:electrical arc deposition method  ammonia  CN  x films
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