| 基于UltraFlex系统进行LVDS接口芯片的测试方法 |
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| 引用本文： | 苏洋. 基于UltraFlex系统进行LVDS接口芯片的测试方法[J]. 电子与封装, 2014, 0(10): 4-7 |
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| 作者姓名： | 苏洋 |
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| 作者单位： | 中国电子科技集团公司第58研究所,江苏无锡,214035 |
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| 摘 要： | 高速接口通常采用差分信号实现,LVDS接口可以满足高速信号传输,对具备LVDS接口芯片的测试方法与单端信号的测试有较大差别。描述了如何使用UltraFlex测试系统进行LVDS接口芯片的测试方法,包括通道分配、测试接口板设计和相关测试设置等内容。此方案已经应用于800 Mbps多路LVDS输入和输出接口的测试。
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| 关 键 词： | LVDS ATE 信号完整性 动态测试向量 |
Method of IC with LVDS Interface Testing |
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| SU Yang. Method of IC with LVDS Interface Testing[J]. Electronics & Packaging, 2014, 0(10): 4-7 |
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| Authors: | SU Yang |
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| Affiliation: | SU Yang (China Electronics Technology Group Corporation No.58 Research Institute, Wuxi 214035, China) |
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| Abstract: | The differential signal can be used as high speed interface, LVDS interface can afford high speed translation, the method of testing LVDS interface has great difference form single signal. The paper describe the method of using UltraFlex to test IC with LVDS interface, the content include how to assign ATE channel, how to design DUT PCB and other test techniques. The method is already used for LVDS input and output signal at 800 Mbps. |
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| Keywords: | LVDS ATE signal integrality dynamic pattern |
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