Design for manufacturing meets advanced process control: A survey |
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| Affiliation: | 1. The Mork Family Department of Chemical Engineering and Materials Science, Ming Hsieh Department of Electrical Engineering, Daniel J. Epstein Department of Industrial and Systems Engineering, University of Southern California, 925 Bloom Walk, HED 211, Los Angeles, CA 90089-1211;2. Department of Electrical and Computer Engineering, National University of Singapore, Blk E4A #04-03, 4 Engineering Drive 3, Singapore 117576, Singapore;1. Department of Urology, Weill Cornell Medical College-New York Presbyterian Hospital, New York, NY, USA;2. Department of Urology, Bern University Hospital, Bern, Switzerland;3. Department of Healthcare Policy and Research, Division of Biostatistics and Epidemiology, Weill Cornell Medical College, New York, NY, USA;4. Department of Medicine, Division of Hematology/Medical Oncology, Weill Cornell Medical College-New York Presbyterian Hospital, New York, NY, USA |
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| Abstract: | Nanometer IC designs are increasingly challenged to achieve manufacturing closure, i.e., being fabricated with high product yield due to feature miniaturizations and process variations. Realizing the critical importance of addressing manufacturability/yield during design (which is loosely termed as DFM, design for manufacturing), there has been a surge of research activities recently from both academia and industry under the “DFM” umbrella. While the primary goal of DFM is to enlarge the manufacturing process yield window, DFM needs to work together with advanced process control (APC) to meet such window, which may be shrinking and changing from design to design. The paper will survey the key DFM activities and discuss related advanced process control issues (i.e., the counterpart of manufacturing for design) to provide a holistic perspective on the design and process integration. |
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