aGroupe de physique des plasmas, Université de Montréal, C.P. 6128, Succursale Centre-ville, Montréal H3C 3J7, Québec, Canada
bDépartement de Génie physique, École Polytechnique de Montréal, Montréal H3C 3A7, Québec, Canada
Abstract:
In order to gain insight into the adhesion mechanisms of diamond films, we examine Si substrates with three different crystallographic orientations at the various stages of the deposition process. This allows one to distinguish the surface phenomena involved in diamond deposition from those due to gaseous plasma processes. We find that the initial ultrasonic scratching treatment produces partial graphitization of the diamond powder, and it controls the crystallite size through the carbon residues. On the other hand, an increased surface roughness due to H-atom etching correlates with increased adhesion. The deposited film adhesion is found to increase in the sequence Si(111)