| 面向微电子器件封装作业的三自由度串并联混合式高速高精度机器人 |
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| 引用本文： | 孙立宁,丁庆勇,祝宇虹,刘新宇. 面向微电子器件封装作业的三自由度串并联混合式高速高精度机器人[J]. 高技术通讯, 2005, 15(2): 20-24 |
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| 作者姓名： | 孙立宁 丁庆勇 祝宇虹 刘新宇 |
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| 作者单位： | 哈尔滨工业大学机器人研究所,哈尔滨,150001;哈尔滨工业大学机器人研究所,哈尔滨,150001;哈尔滨工业大学机器人研究所,哈尔滨,150001;哈尔滨工业大学机器人研究所,哈尔滨,150001 |
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| 基金项目： | 863计划(2003AA404060)资助项目。 |
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| 摘 要： | 针对微电子器件封装作业对高速高精度自动设备的需求，提出了一种由平行四边形支链的平面并联机构和直线运动模块组成的新型三自由度串并联混合式机器人。机器人采用两个集成了高分辨率角位移反馈元件的旋转直接驱动电机和直线音圈电机作为驱动元件。结合了并联机构和直接驱动的优点来实现高速高精度的三自由度平动运动。实验结果表明平面并联机构具有较高的重复定位精度、加速度和较短的建立时间。
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| 关 键 词： | 串并联混合式机器人 高速高精度 直接驱动 封装作业 |
3-DOF Hybrid Kinematics High Speed/High Precision Robot Oriented to the Microelectronic Device Bonding Process |
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| Sun Lining,Ding Qingyong,Zhu Yuhong,Liu Xinyu. 3-DOF Hybrid Kinematics High Speed/High Precision Robot Oriented to the Microelectronic Device Bonding Process[J]. High Technology Letters, 2005, 15(2): 20-24 |
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| Authors: | Sun Lining Ding Qingyong Zhu Yuhong Liu Xinyu |
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| Abstract: | This paper presents a novel 3-DOF hybrid kinematics robot composed of planar parallel mechanism with parallelogram structure and linear drive, which will be used in bonding process of microelectronic device. Two direct drive motors integrated with high resolution encoders and linear voice coil motor are used as driving parts. Combining the advantages of parallel mechanism and direct drive, it is easy for the robot to realize high speed/ high precision operation. The results of experiment proved that the repeatability, acceleration and settling time of robot can satisfy the need of application. |
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| Keywords: | hybrid kinematics robot high speed/high accuracy direct drive bonding process |
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