Abstract: | A method is proposed for numerical calculation of the temperature field of a generalized model of electronic equipment with high component density.Notation x,y,z,x ,y
spatial coordinates, m
-
time, sec
- Lx, Lv, Lz
dimensions of heated zone, m
- x, y, z
effective thermal-conductivity coefficients of heated zone, W/m·deg
- 2
thermal conductivity of chassis, W/m·deg
-
a
z
thermal diffusivity of heated zone along z axis, m2/sec
- c1
effective specific heat of heated zone, J/kg·deg
- 1
effective density of heated zone, kg/m3
- c3, 3, c2, 2
thermophysical characteristics of cooling agent and chassis, J/kg·deg·kg/m3
- qv(x, ), q(x , y )
volume heat-source distribution, W/m3
- qs (x)
surface heat-source distribution, W/m2
- p
number of cooling agent channels
- Fo
Fourier number
- Bi
Biot number
- Ui
coolant velocity in i-th channel, m/sec
- T1(x, ), T2(x, ), T3(x, )
temperature distribution of heated zone, chassis, and coolant, °K
- T30, T10(x), T20(x)
initial temperatures, °K
- T3in
coolant temperature at input to channel, °K
- TT(x)
effective temperature distribution of heat loss elements, °K
- TC
temperature of external medium, °K
-
dimensionless heated zone temperature
- v(x)
local volume heat exchange coefficient, W/m3·deg
- 12(x), 1C(x), 1T(x)
heat liberation coefficients
- W/m2·sec; 21(x , y ), 2c(x , y ), 2T(x , y )
volume heat-exchange coefficients of chassis with heated zone, medium, and cooling elements, W/m3·deg
Translated from Inzhenerno-Fizicheskii Zhurnal, Vol. 40, No. 5, pp. 876–882, May, 1981. |