| 芯片推力方法与MEMS芯片固化工艺的研究 |
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| 引用本文： | 郑志荣,陈学峰,董华,胡乃仁,朱天意.芯片推力方法与MEMS芯片固化工艺的研究[J].中国集成电路,2021(1). |
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| 作者姓名： | 郑志荣 陈学峰 董华 胡乃仁 朱天意 |
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| 作者单位： | 苏州固鍀电子股份有限公司 |
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| 摘 要： | 介绍了封装推力与MEMS(微电子机械系统芯片)固化的通用工艺,提出了芯片固化中遇到的问题。针对异议的工艺与材料进行了试验,采用数理统计方法进行了分析。对MEMS装片材料与结构进行研究,找出芯片推力实施的过程的问题,实施优化MEMS芯片推力方法。最终采用数理统计方法验证了该推力方法在工艺实施过程的可行性,该方法满足了大生产要求。
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| 关 键 词： | 封装 MEMS 芯片推力 |
Research and Innovation of Die Shear Method and Curing Process for MEMS Chip Curing |
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| ZHENG Zhi-rong,CHEN Xue-feng,DONG Hua,HU Nai-ren,ZHU Tian-yi.Research and Innovation of Die Shear Method and Curing Process for MEMS Chip Curing[J].China Integrated Circuit,2021(1). |
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| Authors: | ZHENG Zhi-rong CHEN Xue-feng DONG Hua HU Nai-ren ZHU Tian-yi |
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| Affiliation: | (Suzhou Good-Ark Electronic Co.,Ltd.) |
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| Abstract: | The general process of die shear for MEMS(micro electro mechanical system chip)die bonding is introduced.The problems in the process of chip solidification are suggested.Experiments are carried out for the process and materials which are argued,the method of mathematical statistics is used for analysis.The material and structure of MEMS die bonding are researched,the problems in the implementation process of die shear are found out,and the optimization method of MEMS die shear is implemented.Finally,the feasibility of the die shear method in the process is verified by mathematical statistics.The method meets the requirements of mass production. |
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| Keywords: | Assembly MEMS Die shear |
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