实施系统封装方案以提高系统整体功能和性能

系统集成是实现电子产品高性能,小型化和低成本目标的重要手段。与同芯片上的系统集成(SoC)相比,封装层次上的系统集成(SiP)的开发具有成本低、周期短和灵活性高等优势。本文以典型的无线电子系统为例,提出了有效的系统分割设计方法,介绍了一些用于子系统模块封装的方法,并强调了系统公司与封装、基板及其它主被动元件供应商之间协调合作对成功的模块式电子系统开发的重要性。

Enhancing Overall System Functionality and Performance with the Right Packaging Solutions

System integration is a very important method to achieve performance improvement, miniaturization, and cost reduction in electronic product development. Compared with SoC sol level may provide benefits that include more cost saving, more flexibility, ution, and system level integration at packaging a shorter development cycle paper, we have proposed a system design methodology to demonstrate that an effective wireless system design achieved when the right packaging solutions are adopted through collaboration and co-design among packaging, substrate, and other active/passive component companies. In this could be system,