In-situ neural network process controller for copper chemical mechanical polishing |
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Authors: | Gou-Jen Wang Bor-Shin Lin Kang J Chang |
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Affiliation: | (1) Department of Mechanical Engineering, National Chung-Hsing University, Taichung, Taiwan;(2) Department of Manufacturing Systems Engineering and Management, California State University, Northridge, USA |
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Abstract: | Process control is one of the key methods to improve manufacturing quality. This research proposes a neural network based
run-to-run process control scheme that is adaptive to the time-varying environment. Two multilayer feedforward neural networks
are implemented to conduct the process control and system identification duties. The controller neural network equips the
control system with more capability in handling complicated nonlinear processes. With the system information provided by this
neural network, batch polishing time (T) an additional control variable, can be implemented along with the commonly used down force (p) and relative speed between the plashing pad and the plashed wafer (v).
Computer simulations and experiments on copper chemical mechanical polishing processes illustrate that in drafting suppression
and environmental changing adaptation that the proposed neural network based run-to-run controller (NNRTRC) performs better
than the double exponentially weighted moving average (d-EWMA) approach. It is also suggested that the proposed approach can
be further implemented as both an end-point detector and a pad-conditioning sensor. |
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Keywords: | Copper chemical mechanical polishing Neural-networks Run-to-run process control |
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