| 脉冲电镀发展概况 |
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| 引用本文： | 向国朴. 脉冲电镀发展概况[J]. 电镀与涂饰, 2000, 19(4): 43-47 |
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| 作者姓名： | 向国朴 |
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| 作者单位： | 天津大学,应用化学系,天津,300072 |
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| 摘 要： | 总结脉冲电镀应用于镀铬、镀铜、镀镍及镍合金 ,镀金及金合金 ,镀银及银合金 ,镀钯及钯合金的现状 ,简述了脉冲换向电流电镀 ,脉冲电镀在复合镀层和制备非晶态合金等方面的研究。
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| 关 键 词： | 脉冲电流 电镀 |
Development status of pulse current plating |
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| XIANG Guo-pu. Development status of pulse current plating[J]. Electroplating & Finishing, 2000, 19(4): 43-47 |
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| Authors: | XIANG Guo-pu |
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| Abstract: | Application status of pulse current plating in chromium, copper, nickel and its alloy, gold and its alloy, silver and its alloy, palladium and its alloy electroplating were summarized. Pulse reverse plating, composite pulse plating and amorphous alloy pulse plating were also described. |
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| Keywords: | pulse current electroplating |
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