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Heat transfer and thermal storage behaviour of gypsum boards incorporating micro-encapsulated PCM
Authors:Chi-ming Lai  RH Chen
Affiliation:a Department of Civil Engineering, National Cheng-Kung University, 1, University Road, Tainan City 701, Taiwan
b Department of Mechanical Engineering, Southern Taiwan University, Taiwan
Abstract:In the application of energy storage and thermal environmental control, PCM (Phase Change Material) is a very promising material choice. This study incorporated mPCM (micro-encapsulated PCM) into gypsum to make mPCM gypsum board and then investigated the physical properties, heat transfer and thermal storage behaviour. The major control parameters are wall temperatures and the weight percentages of mPCM added to the gypsum boards. A melting fraction correlation, reduced from our test data and based on Stefan number (Ste), subcooling (Sb) and Fourier number, is proposed. It shows that case with a higher Ste or Sb can have a higher heat transfer through the hot wall. Thermal storage behaviour of mPCM gypsum boards is then analyzed.
Keywords:Phase change material  Energy  Solar heat gain
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