| 无铅焊料实用化技术研究 |
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| 引用本文： | 朱虹姣,欧昌银,胡琼,李茂松. 无铅焊料实用化技术研究[J]. 微电子学, 2007, 37(2): 204-206 |
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| 作者姓名： | 朱虹姣 欧昌银 胡琼 李茂松 |
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| 作者单位： | 中国电子科技集团公司,第二十四研究所,重庆,400060 |
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| 摘 要： | 选取BSn89.3CuInAg和BSn90.7CuInAg两种无铅焊料,对其剪切强度、热冲击、温度循环、机械冲击、扫频振动、恒定加速度、空洞检测等性能进行了一系列试验,验证了无铅焊料的可靠性。结果证明,无铅焊料的各项性能均优于铅锡共晶焊料。因此,无铅焊料逐渐取代铅锡焊料是可行的,也是必然的。
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| 关 键 词： | 无铅焊料 剪切强度 封装可靠性 |
| 文章编号： | 1004-3365（2007）02-0204-03 |
| 修稿时间： | 2006-10-162006-12-28 |
An Investigation into the Utilization of Lead-free Soldering Technology |
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| ZHU Hong-jiao,OU Chang-yin,HU Qiong,LI Mao-song. An Investigation into the Utilization of Lead-free Soldering Technology[J]. Microelectronics, 2007, 37(2): 204-206 |
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| Authors: | ZHU Hong-jiao OU Chang-yin HU Qiong LI Mao-song |
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| Affiliation: | Sichuan Institute of Solid-State Circuits, China Electronics Technology Croup Corp. , Chongqing 400060, P.R. China |
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| Abstract: | A series of experiments are made on BSn89.3CuInAg and BSn90.7CuInAg to investigate the shear strength,thermal impact,temperature cycle,mechanical strike,swing frequency vibration,constant acceleration,cavity detection and PIND performances of the lead-free solders.Experimental results indicate that these lead-free solders are superior in all performances over the Sn-Pb solders. |
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| Keywords: | Lead-free solder Shear strength Package reliability |
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