电力电子集成模块用冷板中液流通道结构优化及传热数值分析

提出了水道结构分别为S型加分流片和螺旋型的两种新型冷板结构.并对这两种新型结构以及传统直线型流道和S型流道冷板的流场和温度场进行了数值模拟,将流阻性能和换热性能进行对比.模拟结果表明, S型加分流片的水道结构使对流换热系数明显提高,在相同的进口流速和进口温度下,S型加分流片结构冷板上芯片的最高温度比传统直线型水道冷板上的芯片温度低19℃,比传统S型水道冷板上芯片的温度低23℃.

Structure Optimization of Liquid Passage and Haet Transfer Research of Cold Plates Used for Integrated Power Electronics Module

This paper presents two new type cold plates,whose liquid passages are respectively S-shape with fins and screw shape.The temperature and flow fields of the new cold plates used to integrated power electronics module(IPEM)are investigated.Furthermore,the flow resistance and thermal performance of the new cold plates are compared with that of the current straight-line passage cold plate and S-shape passage cold plate.The results indicated that the convection heat transfer coefficient of the cold plate with l...