Scalable Multi-harmonic Large-Signal Model for AlGaN/GaN HEMTs Including a Geometry-Dependent Thermal Resistance

A scalable large-signal model of AlGaN/GaN High electron mobility transistors (HEMTs) suitable for multi-harmonic characterizations is presented.This model is fulfilled utilizing an improved drain-source current (Ids) formulation with a geometry-dependent thermal resistance (Rth) and charge-trapping modification.The Ids model is capable of accurately modeling the highorder transconductance (gm),which is significant for the prediction of multi-harmonic characteristics.The thermal resistance is identified by the electro-thermal Finite element method (FEM) simulations,which are physically and easily scalable with the finger numbers,unit gate width and power dissipations of the device.Accurate predictions of the quiescent currents,S-parameters up to 40GHz,and large-signal harmonic performance for the devices with different gate peripheries have been achieved by the proposed model.