单晶材料皮秒激光旋切制孔热过程影响研究

根据超短脉冲激光同材料作用的原理,材料通过光化学机制被去除,加工区域的瞬时温度将超过材料的气化温度值。通过热成像仪对皮秒激光旋切制孔过程中的加工区域进行实时观测,研究了皮秒激光打孔过程中的热过程,比较了同轴气体的存在对加工区域温度场的影响,指出在皮秒激光旋切制孔工艺中,并未观测到单晶材料加工区域的温度升高到气化、液化温度以上的情况,加工区域的温度仍保持在较低水平。因此从宏观上看,皮秒激光制孔工艺属于"冷加工"范畴。提出的通过热成像仪对制孔过程在线控制的方法,可为单晶材料超快激光打孔工艺参数的优化及过程控制提供参考。

Heat Process Analysis on Picosecond Laser Percussion Drilling of Single Crystal Material

As the principle of the ultrashort pulse laser applied on the material indicated,the ablation of the material is based on photochemical mechanism,on which the temperature of the machined area could rise above the vaporization temperature.The temperature field in the drilling process is monitored by infrared thermography,thus the heat behavior is studied.Moreover,effect of the application condition of coaxial-gas on the temperature field is investigated.Results show that no temperature higher than vaporization temperature of the material is observed,the temperature field stays generally at a low temperature level,leading to a cold drilling environment.On this thesis,an online monitoring method for picosecond drilling process by infrared thermography is proposed,and it offers reference for optimization of picosecond laser drilling parameters and picosecond laser drilling process control.