| 酸性镀铜中铜粉产生的原因及控制 |
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| 引用本文： | 李彩华,李燕群,黄中越. 酸性镀铜中铜粉产生的原因及控制[J]. 南方金属, 2005, 0(2): 45-46 |
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| 作者姓名： | 李彩华 李燕群 黄中越 |
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| 作者单位： | 广东省冶金产品质量监督检测中心,广东,广州,510640 |
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| 摘 要： | 着重讨论了光亮酸性镀铜过程中“铜粉”产生的原因及其控制，从而有效避免铜粉在镀液中产生，保证了遮模产品的质量．
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| 关 键 词： | 铜粉 电镀 阳极膜 |
| 文章编号： | 1009-9700(2005)02-0045-02 |
| 修稿时间： | 2004-07-21 |
Cause and control of the formation of copper powder in acid copper-plating |
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| LI Cai-hua,LI Yan-qun,HUANG Zhong-yue. Cause and control of the formation of copper powder in acid copper-plating[J]. Southern Metals, 2005, 0(2): 45-46 |
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| Authors: | LI Cai-hua LI Yan-qun HUANG Zhong-yue |
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| Abstract: | The cause of the formation of copper powder in bright acid copper-plating is discussed, and its control methods proposed in this article. By doing so, the copper powder is avoided in the plating solution, and the product (mask die) quality ensured. |
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| Keywords: | copper powder plating anodized film |
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