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薄圆柱体高频感应温度场的测量和有限元模拟
引用本文:马伯江,赵程,张淼,侯俊英. 薄圆柱体高频感应温度场的测量和有限元模拟[J]. 中国测试技术, 2006, 32(3): 9-11
作者姓名:马伯江  赵程  张淼  侯俊英
作者单位:青岛科技大学,山东,青岛,266061
摘    要:本文利用自制的NiCr-NiAl热电偶精确地测量了薄圆柱工件端面高频感应温度场的分布;应用有限元分析软件ANSYS/Thermal对高频感应加热过程的温度场进行了模拟.热电偶测量的数据直观可信,但测取工件温度场分布费时费力;有限元分析则可较为快速获知工件各处的温度,弥补了实验工作的不足.本文研究结果显示,两种方法得出的结果具有可比性,能够相互参照.

关 键 词:薄圆柱体  热电偶  测温  有限元  温度场模拟
文章编号:1672-4984(2006)03-0009-03
收稿时间:2005-08-20
修稿时间:2005-08-202005-11-12

Thermal field measurement and FEA simulation of high-frequency induction heating for thin column
MA Bo-jiang,ZHAO Cheng,ZHANG Miao,HOU Jun-ying. Thermal field measurement and FEA simulation of high-frequency induction heating for thin column[J]. China Measurement Technology, 2006, 32(3): 9-11
Authors:MA Bo-jiang  ZHAO Cheng  ZHANG Miao  HOU Jun-ying
Affiliation:Qingdao University of Science and Technology, Qingdao 266061, China
Abstract:Thermal field of thin column for high frequency induction was exactly measured by homemade NiCr-NiAl thermocouple.It was simulated by finite element analysis(FEA) software,Analysis/Thermal.Although data got by high-performance thermocouple were credible,it was difficult to test temperature distribution around.However,FEA can cover the shortage on the experiment.The results show that data got by high-performance thermocouple is close to that through FEA.
Keywords:Thin column   Thermocouple   Temperature measurement   Finite element   Thermal field simulation
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