| FPC分层板的耐弯折性研究 |
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| 引用本文： | 杨宏,谢飞,梁立. FPC分层板的耐弯折性研究[J]. 印制电路信息, 2010, 0(10): 31-32,48 |
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| 作者姓名： | 杨宏 谢飞 梁立 |
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| 作者单位： | 广东生益科技股份有限公司,广东,东莞,523039 |
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| 摘 要： | 文章采用耐折性和耐挠曲性两种试验方法,分析了典型规格的分层板应用于折叠式手机和滑盖手机中的耐弯性,证实了分层板良好的耐弯折性可靠性,并提出进一步提高分层板耐弯折性的设计思路。
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| 关 键 词： | 分层板 耐折性 耐挠曲性 |
Research on Layered Flexible Printed Circuit for Flexural Endurance |
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| YANG Hong,XIE Fei,LIANG Li. Research on Layered Flexible Printed Circuit for Flexural Endurance[J]. Printed Circuit Information, 2010, 0(10): 31-32,48 |
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| Authors: | YANG Hong XIE Fei LIANG Li |
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| Affiliation: | YANG Hong, XIE Fei, LIANG Li |
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| Abstract: | The flexural endurance of typical specification layered board which used in folding phone and sliding phone is discussed with the folder endurance and the bend endurance methods in this paper.It is confirmed that layered board have excellent reliability of flexural endurance.Furthermore,the design ideas which can improve the flexural endurance of layered board are proposed. |
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| Keywords: | layered Board folder endurance bend endurance |
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