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PCB微钻钎焊工艺实验研究
引用本文:邱玮桢,侯忠滨,裴顺杰.PCB微钻钎焊工艺实验研究[J].工具技术,2011,45(11):41-44.
作者姓名:邱玮桢  侯忠滨  裴顺杰
作者单位:西北工业大学
摘    要:对印刷电路板用微型钻头的钎焊工艺进行了探讨,实验采用硬质合金作为微型钻头的刀头材料,不锈钢作为刀体,通过高频感应钎焊的方式对两者进行连接,以抗弯强度作为刀具强度的检测方式.同时采用正交试验方差分析方法,通过实验找出影响微钻钎焊强度的显著因素,确定最佳生产条件.

关 键 词:微型钻头  感应钎焊  抗弯强度  正交实验

Experimental Research on Brazing Process of Micro-drilling Tool for PCB
Qiu Weizhen,Hou Zhongbin,Pei Shunjie.Experimental Research on Brazing Process of Micro-drilling Tool for PCB[J].Tool Engineering(The Magazine for Cutting & Measuring Engineering),2011,45(11):41-44.
Authors:Qiu Weizhen  Hou Zhongbin  Pei Shunjie
Affiliation:Qiu Weizhen,Hou Zhongbin,Pei Shunjie,Postgraduate,College of Mechanical Engineering,Northwestern Polytechnical University,Xi'an 710072,China
Abstract:It discusses the brazing process of micro-drilling tool for printed circuit boards(PCB).The experiment makes cemented carbide as the material of blade,stainless steel as tool body,connects each other by high frequency induction brazing,bending strength as a way of testing strength of the brazing.It uses the method of orthogonal test and analysis of variance to identify significant factors which affect the strength of induction brazing,this experiment also determines the best production conditions.
Keywords:micro-drilling  induction brazing  bending strength  orthogonal test  
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