| 下一代汽车电子的刚-挠性PCB |
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| 引用本文： | 丁志廉. 下一代汽车电子的刚-挠性PCB[J]. 印制电路信息, 2006, 0(6): 50-53 |
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| 作者姓名： | 丁志廉 |
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| 摘 要： | 讨论了用于汽车电子的刚-挠电路板材料,包括了多(动态)可挠曲的(聚酰亚胺)挠性电路材料、少(半)可挠曲的(薄FR-4挠性)电路材料和中等可挠曲的黄色-挠曲电路材料.
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| 关 键 词： | 汽车电子 可挠曲的基板材料 多(动态)挠曲电路 少(半)挠曲电路 黄色-挠曲电路 |
Rigid Flexible PCBs for the Next Generation of Automotive Electronics |
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| Ding Zhilian. Rigid Flexible PCBs for the Next Generation of Automotive Electronics[J]. Printed Circuit Information, 2006, 0(6): 50-53 |
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| Authors: | Ding Zhilian |
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| Affiliation: | Ding Zhilian |
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| Abstract: | A discussion of rigid-flex circuit board material for applications in automotive electronicsystems,including the flexible multiflex(PI) circuit material,the flexible semiflex(thin FR-4) circuit material,and the flexible yellow-flex circuit material. |
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| Keywords: | automotive electronics flexible substrat material multiflex flexible circuit semiflex flexible circuit yellow-flex circuit |
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