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| 高密度封装IC的高加速应力试验研究 | |
| 引用本文： | 张善伦,来萍,尧彬,刘建,李斌.高密度封装IC的高加速应力试验研究[J].微纳电子技术,2010,47(8). |
| 作者姓名： | 张善伦 来萍 尧彬 刘建 李斌 |
| 作者单位： | 1. 华南理工大学,电子与信息学院,广州,510640;电子元器件可靠性物理及其应用技术国家级重点实验室,广州,510610 2. 电子元器件可靠性物理及其应用技术国家级重点实验室,广州,510610 3. 华南理工大学,电子与信息学院,广州,510640 |
| 基金项目： | 国家部委基金支持项目 |
| 摘 要： | 采用在线监测技术对高密度封装IC样品进行温度步进试验、温度循环试验和振动步进试验等高加速应力试验,确定了产品的耐受应力极限,验证了本试验方案和试验监测技术的有效性和可行性。通过失效分析,确定了高加速应力下电路的失效模式和失效机理。结果表明:高密度塑封IC元件在高加速温循应力下比在随机振动应力下失效更为集中,温循试验在-65~165℃温度范围内,失效显著且集中在3个循环以内,主要包括塑封料和引线框架、基板的分层以及内键合点脱离,样品耐受随机振动量级超过50grms。研究结果可为器件级高加速应力试验研究提供参考。 |
| 关 键 词： | 高加速应力试验 在线监控 温度循环 振动步进 失效模式 |
Highly Accelerated Stress Test of High Density Packaging ICs |
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| Zhang Shanlun,Lai Ping,Yao Bin,Liu Jian,Li Bin.Highly Accelerated Stress Test of High Density Packaging ICs[J].Micronanoelectronic Technology,2010,47(8). | |
| Authors: | Zhang Shanlun Lai Ping Yao Bin Liu Jian Li Bin |
| Affiliation: | Zhang Shanlun1,2,Lai Ping2,Yao Bin2,Liu Jian2,Li Bin1(1.School of Electronic , Information Engineering,South China University of Technology,Guangzhou 510640,2.National Key Laboratory for Reliability Physics , Application Technology of Electronic Products,Guangzhou 510610,China) |
| Abstract: | The highly accelerated stress test,including the temperature step test,temperature cycle test and vibration step test,were carried out for high-density packaging ICs with the online monitoring technology.The stress tolerance limits of the products were determined.The effectiveness and feasibility of the experimental project and online monitoring technique were verified.Through the failure analysis,the failure mode and failure mechanism were determined under the highly accelerated stress.The results show tha... |
| Keywords: | highly accelerated stress test online monitoring temperature cycling vibration stepping failure mode |
| 本文献已被 CNKI 万方数据 等数据库收录！ | |