高结合强度、高分散性光亮酸性镀铜工艺的研究

研究了一种具有高结合强度，又具有高分散性的光亮酸性镀铜工艺，经试验和生产证明，选择特殊的除油剂，采用特定的除油和活化工艺，可在磊提高镀层与基体的结合强度，另外，对镀铜溶液也进行了研究，采用霍尔槽法测试比较了该镀液和高分散能力的焦磷酸铜镀液的分散能力，确认这两种镀液分散能力相当，但该工艺优于焦磷酸铜工艺，重要的是采用此工艺提高了电流密度范围，大大缩短了电镀时间。

ACIDIC COPPER PLATING TECHNOLOGY WITH HIGH POLISH AND HIGH DISPERSIBILITY OF PLATING SOLUTION AND HIGH BOND STRENGTH BETWEEN FILM AND SUBSTRATE

A technological investigation of acidic copperplating with high polish, high dispersibility of plating solution and high bond strength between film and substrate has been performed. It is proved by experiments and production that using special oil removing and activating process can raise greatly the bond strength between film and substrate. In addition, copperplating solution has also been studied. Hell cell experiment proves that the dispersibility of the plating solution and that of the copper pyrophosphate plating solution with high dispersibility are not much different. But the new technology has a lot of advantages, for example, raising current density and shortening the plating time, compared with the former technology.