陶瓷封装电沉积Ni-Co合金的研究

为了使用Ni-Co合金代替Ni作为陶瓷封装电镀金层的底镀层以提高它的抗高温老化能力，系统地研究了从氨基磺酸盐镀液中获得低Co含量Ni-Co合金镀层的规律，研究发现镀层中Co含量随着镀液中Co含量的升高而升高，随着镀液中温度的升高而略有上升，随着电流密度的上升而下降，镀液pH值对镀层中Co含量基本没有什么影响。研究还发现镀层中加入Co能够降低镀层的内应力，但同时引起镀层硬度的上升。推荐在陶瓷封装中使用含15％Co(质量分数）左右的Ni-Col合金镀层来代替Ni作为底镀层。

Ni-Co Alloy Electroplating for Ceramic Packages

Using Ni-Co alloy to substitute Ni as the sublayer of gold plating for ceramic package is an important way to improve its resistance to high-temperature. Ni-Co alloy electroplating with low Co content from sulfamate bath were systematically studied. Results indicated that Co content in the plating increased with bath temperature and Co content in the bath and decreased with the increasing of current density, but was independent on the pH of bath. The addition of Co could reduce internal stress of plating, but increase its hardness. It was recommended that Ni-Co plating with about 15wt% Co could be used to replace Ni as the sublayer for ceramic package.