Grinding characteristics,material removal and damage formation mechanisms in high removal rate grinding of silicon carbide |
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| Authors: | Sanjay Agarwal P. Venkateswara Rao |
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| Affiliation: | 1. Department of Mechanical Engineering, Bundelkhand Institute of Engineering & Technology, Jhansi 284128, India;2. Department of Mechanical Engineering Indian Institute of Technology, New Delhi 110016, India;1. State Key Laboratory of Advanced Design and Manufacturing for Vehicle Body, Hunan University, Changsha, Hunan Province 410082, PR China;2. Piezoelectric Device Laboratory, School of Mechanical Engineering and Mechanics, Ningbo University, Ningbo, Zhejiang Province 315211, PR China;3. State Key Laboratory of Powder Metallurgy, Central South University, Changsha, Hunan Province 410083, PR China;1. School of Automotive Engineering, Hubei Key Laboratory of Advanced Technology of Automotive Parts, Wuhan University of Technology, Wuhan 430070, China;2. State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan 430074, China;3. College of Mechanical Engineering, Donghua University, Shanghai 201620, China |
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| Abstract: | Development of advanced ceramics such as silicon carbide has gained significant importance because of their desirable properties. However, their engineering applications are still limited owing to the limitations in developing damage-free and economical machining techniques. It is often desired to increase the machining rate to improve productivity while maintaining the desired surface integrity. The success of this approach, however, requires a fundamental understanding of the material removal and damage formation mechanism in grinding. In this paper, high removal rate grinding of silicon carbide was investigated with respect to material removal and basic grinding parameters using a diamond grinding wheel. The results showed that the material removal was primarily due to the microfracture and grain dislodgement under the grinding conditioned selected. For grain dislodgement removal mode, the relationship for the removal rate in scratching based on a simple fracture mechanics analysis has been established. This research provides valuable insights into the surface and subsurface integrity and material removal mechanism during high removal rate grinding of silicon carbide. |
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