Study on diamond vacuum brazed with Cu-based filler metal containing Cr

To reduce the thermal damage to the diamond and production cost, Cu-Sn-Ni-Cr and Cu-Sn-Cr were used to braze the diamond. SEM, EDS, and XRD were used to analyze the morphology of the diamond and the microstructure of the interface and the brazing alloy. Graphitization of the brazed diamond was tested by laser Raman, and the static compressive strength and toughness index of the diamond abrasive were measured. The results show that it realizes chemical metallurgical bonding between the diamond and either of these two filler metals, while Cu-Sn-Ni-Cr shows better wettability to the diamond. The brazed diamond has complete morphology and smoothing surface, there is almost no graphite in the diamond, but the static compressive strength and TI decrease slightly. On the surface of the diamond, it generates continuous laminar (Cr, Fe)₇C₃. The bonding strength between the diamond and the filler metal can meet the need of grinding. During the solidification process of the brazing alloy, dendrite α-Cu precipitates out firstly; then there is peritectic transformation and eutectoid transformation to form dendrite α-Cu, Cu_6.5Sn, Cu₉NiSn₃, and eutectoid α-Cu.