Temperature-dependent electrical resistance of conductive polylactic acid filament for fused deposition modeling

This study characterizes the microstructure and temperature dependence of resistance of two commercially available electrically conductive polylactic acid (PLA) composites for fused deposition modeling (FDM): PLA-carbon black and PLA-graphene. No microstructural changes were observed between the filament and the printed parts; however, the resistivity of the filament was found to drop by four to six times upon FDM. Also, compared to the resistivity of individual extruded wire, the resistivity of the printed parts was found to be up to 1500 times higher for PLA-graphene and up to 300 times higher for PLA-carbon black. The raw PLA-carbon black filament and printed wire showed a positive temperature coefficient of resistance (α) value between ~?0.03 and 0.01 °C^?1, which makes them more suitable for sensor development. The raw PLA-graphene filament and printed wire did not exhibit a significant α, which makes them more suitable for printing wires. However, the parts made with multilayer FDM exhibited a negative or a negligible α up to a certain temperature prior to exhibiting a positive α; further, these α values were significantly lower than those obtained for the filaments before or after extrusion. These findings enable proper selection of commercial conductive FDM filaments for enabling quicker prototyping of electronics and sensors.