Steppingstone-inspired construction of high vertical thermal conductivity material with low carbon fiber content |
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| Affiliation: | 1. School of Engineering and Technology, China University of Geosciences (Beijing), Beijing, 100083, China;2. HYMN Advance Materials Technology (Shenzhen), Shenzhen, 518000, China;3. Zhengzhou Institute, China University of Geosciences (Beijing), Zhengzhou, 451283, China;4. Anhui Key Laboratory of High-Performance Non-ferrous Metal Materials, Anhui Polytechnic University, Wuhu, 241000, PR China;1. Materials Science and Environmental Chemistry Lab, Lab E-21, Department of Environmental Sciences, Fatima Jinnah Women University, The Mall, Rawalpindi, 46000, Pakistan;2. Department of Materials, Photon Science Institute, Sir Henry Royce Institute, Alan Turing Building, The University of Manchester, Oxford Road, Manchester, M13 9PL, UK;3. Department of Chemistry, College of Science, Majmaah University, Al-Majmaah, 11952, Saudi Arabia;4. Chemistry Department, Faculty of Science and Arts in Almakhwah, Al-Baha University, Al Baha, Saudi Arabia;1. Key Laboratory of Environment-Friendly Polymeric Materials of Anhui Province, School of Chemistry & Chemical Engineering, Anhui University, Hefei, Anhui 230601, China;2. School of Chemistry and Chemical Engineering, Hefei University of Technology, Hefei, Anhui 230009, China;1. Anhui Key Laboratory of High-Performance Non-Ferrous Metal Materials, Anhui Polytechnic University, Wuhu, 241000, PR China;2. School of Engineering and Technology, China University of Geosciences (Beijing), Beijing, 100083, PR China;3. School of Materials Science and Engineering, Nanjing University of Science and Technology, Nanjing 210094, PR China |
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| Abstract: | Thermal interface materials (TIMs) with good thermal conductivity are paramount in mitigating the heat concentration challenges encountered during the operation of highly integrated components in sophisticated electronic devices. To optimize the comprehensive performance of TIMs, a balance must be struck: minimizing the filler concentration to attenuate materials hardness while maximizing filler content to bolster the thermal conduction pathway. Drawing inspiration from the orientation of tree branches passing through steppingstones in river, a method was proposed in this study. This method exploits the shear effect of carbon fiber (CF), owing to viscosity variances during diameter extrusion, and the differential flow velocity between CF and alumina to induce a significant degree of orientation. Combined with subsequent flipping and bonding, a TIM with vertically oriented CF was prepared. The TIM was obtained with a mere 12.1 wt% CF incorporation, the composite exhibits a through-plane thermal conductivity of 21.29 W/(m·K), representing an enhancement of two orders of magnitude relative to pristine silicone rubber, while retaining its flexibility and deformability. The orientation degree and high efficiency orientation effect of CF have been characterized via scanning electron microscopy (SEM), thermal conductivity test and light-emitting diode (LED) temperature rise test. |
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| Keywords: | Carbon fiber Orientation Polymeric composites Thermal properties Thermal interface materials |
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