大尺寸微波多芯片组件微组装过程变形研究

文中针对大尺寸多通道高集成微波多芯片组件在微组装过程中的变形情况开展研究。结果表明：壳体焊接基板后，壳体底面向组件腔体方向内凹，最大变形量相当于底面厚度的6.9%；组件密封后，壳体底面向腔体内凹的程度减小，最大变形量相当于底面厚度的3.0%；精铣底面后，壳体平面度趋好，最大变形量不超过底面厚度的1.2%，满足组件安装和高效散热需求；组件机械开盖二次封盖后，壳体底面变形从向腔体内凹转变为向底面外凸，最大变形量小于底面厚度的1.5%。组件二次封盖后不再采取措施，组件安装和高效散热要求仍能得到保障。

Research on Deformation of Large Size Microwave Multi-chip Module during Micro-assembly

The deformation of large size, multi-channel and highly integrated microwave muti-chip modules during the micro-assembly process is studied in this paper. The results show that the shell bottom is concave in direction of the module cavity and the maximum deformation is equivalent to 6.9% of the thickness of shell bottom plate after the substrate is soldered to the shell; after the module is sealed, the concave degree of the shell bottom facing the cavity is reduced and maximum deformation is equivalent to 3.0% of the thickness of the shell bottom plate; after milling the bottom surface, the flatness of the shell tends to be better and the maximum deformation is not more than 1.2% of the thickness of the shell bottom plate, which meets the requirements of module installation and efficient heat dissipation; after the mechanical opening and secondary sealing of the module, the deformation of the bottom surface of the shell changes from concave towards the cavity to convex towards the bottom and the maximum deformation is less than 1.5% of the thickness of the shell bottom plate. The module installation and efficient heat dissipation requirements can still be guaranteed without taking measures.