| 金属/BAS微晶玻璃复合基板的制备与性能研究 |
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| 引用本文： | 杨娟,堵永国,张传禹,郑晓慧.金属/BAS微晶玻璃复合基板的制备与性能研究[J].电子元件与材料,2005,24(7):44-46. |
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| 作者姓名： | 杨娟 堵永国 张传禹 郑晓慧 |
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| 作者单位： | 国防科技大学航天与材料工程学院材料工程系,湖南,长沙,410073 |
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| 基金项目： | 国家高技术研究发展计划(863计划) |
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| 摘 要： | 制备了与0Cr18Ni9不锈钢热膨胀相匹配的Ba-Al-Si系微晶玻璃,利用流延法将玻璃制成生瓷带。在不锈钢板表面生瓷带经温压烧结后形成金属/微晶玻璃复合基板。电气性能测试结果,介质层厚度>73.5μm时,击穿电压>1.28kV,泄漏电流<0.05mA;微晶玻璃膨胀系数为10×10–6/℃。
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| 关 键 词： | 复合材料 复合基板 微晶玻璃 生瓷带 |
| 文章编号： | 1001-2028(2005)07-0044-03 |
Manufacturing of Metal/Glass-ceramic Composite Substrate |
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| YANG Juan,DU Yong-guo,ZHANG Chuan-yu,ZHENG Xiao-hui.Manufacturing of Metal/Glass-ceramic Composite Substrate[J].Electronic Components & Materials,2005,24(7):44-46. |
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| Authors: | YANG Juan DU Yong-guo ZHANG Chuan-yu ZHENG Xiao-hui |
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| Abstract: | The green tape was casted by the Ba-Al-Si ceramic-glass, whose thermal expansion coefficient was matching with the 0Cr18Ni9 stainless steel. Laminated and sintered green tape formed a compact dielectric layer on the stainless steel board. Then, the metal/glass-ceramic composite substrate was manufactured. When the thickness of the dielectric layer is 73.5 μm, the breakdown voltage is larger than 1.28 kV, the lead current is smaller than 0.05 mA. The ceramic-glass CTE is 10×10–6/℃. |
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| Keywords: | composite composite substrate glass-ceramic green tape |
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