ZA27/SiCp颗粒增强复合材料界面特性的研究

用有限元法分析了ZA27/SiC_p颗粒增强复合材料在外加载荷作用下基体与增强相界面应力场及基体内的塑性应变.结果表明：拉伸应力作用下界面法向应力引起极区基体与增强相脱；Von Mises等效应力在极区与赤道区之间的界面处使基体屈服；界面处残余法向应力较高，可能造成界面脱粘.基体内近界面残余切向应力具有抑制裂纹在基体中扩展的趋势.重载时复合材料在高温和高压应力共同作用下，基体发生严重的塑性流变，从而产生大量的横交错裂纹，并使增强相与基体在界面脱粘.

Interface characteristics of ZA27/SiCp composites

Using finite element method, the stress distribution at interface between matrix and reinforced particles in SiCp/ZA27 composite has been analyzed. The plastic strain in matrix of composite has been calculated. Results show that under tensile stress, the normal stress at interface leads to interfacial de-bonding, and the Von Mises stress make matrix yield at interface between pole and equator areas. The normal residual stress at interface is great, which can result in the interface de-bounding. The tangential residual stress near interface in matrix can restrain the crack propagation in matrix. The matrix occur heavily plastic flow and many crisscross cracks appears under high temperature and compressive stress with over loading, which makes the interface de-bounding.