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封装用有机硅材料的制备及性能研究
引用本文:吴启保,青双桂,熊陶,王芳,吕维忠,罗仲宽.封装用有机硅材料的制备及性能研究[J].广东化工,2009,36(2):23-25.
作者姓名:吴启保  青双桂  熊陶  王芳  吕维忠  罗仲宽
作者单位:1. 深圳市方大国科光电技术有限公司,广东,深圳,518055
2. 深圳大学,化学与化工学院,广东,深圳,518060
3. 深圳市帝源电子有限公司,广东,深圳,518106
基金项目:深圳市科技计划深港创新圈项目 
摘    要:具有高效节能、绿色环保等优点的半导体自光照明LED灯在照明市场的前景备受各国瞩目,对LED封装材料的研究也备受关注。文章采用复合硅树脂和有机硅油混合,在催化剂的条件下发生加成反应,得到无色透明的有机硅封装材料。采用红外光谱仪、紫外可见分光光度计、同步热分析仪等仪器设备对有机硅封装材料进行测试和分析。将制备的有机硅封装材料应用于大功率自光LED上,研究有机硅封装材料的透光率对LED出光效率的影响。

关 键 词:有机硅树脂  封装材料  LED  固化

The Preparation and Characteration of Organic Silicone Encapsulant
Wu Qibao,Qing Shuanggui,Xiong Tao,Wang Fang,Lv Weizhong,Luo Zhongkuan.The Preparation and Characteration of Organic Silicone Encapsulant[J].Guangdong Chemical Industry,2009,36(2):23-25.
Authors:Wu Qibao  Qing Shuanggui  Xiong Tao  Wang Fang  Lv Weizhong  Luo Zhongkuan
Affiliation:Wu Qibao, Qing Shuanggui, Xiong Zao, Wang Fang, Lv Weizhong, Luo Zhongkuan. (1. Shenzhen Fangda Guoke Optronics Technical Co. Ltd., Shenzhen 518055 ; 2. College of Chemistry and Chemical Engineering, Shenzhen University, Shenzhen 518060; 3. Shenzhen Diyuan Electronic Co. Ltd., Shenzhen 518106, China)
Abstract:LED has been attracted much attention in the field of semiconductor, because of its energy conservation and environment-friendly. In the paper, a transparant encapsulant was prepared by addition reaction with silicone and silicon oil. The product was measured by TG/DSC, IR, UV-vis, viscometer and colouring machine. The light extraction of white light high-power LED with as-prepared encapsulant was also studied.
Keywords:LED
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