| 图形电镀铜的常见缺陷及故障排除 |
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| 引用本文： | 殷春喜.图形电镀铜的常见缺陷及故障排除[J].印制电路信息,2004(2):51-54. |
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| 作者姓名： | 殷春喜 |
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| 作者单位： | 中国电子科技集团第十五研究所印制板中心,100083 |
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| 摘 要： | 本文主要阐述印制电路板生产中图形电镀铜常见缺陷及成因,查找影响其品质的因素和工序并结合相关生产制定相应的预防措施,有效提高产品质量。
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| 关 键 词： | 图形电镀铜 常见缺陷 故障排除 |
Common Defects Troubleshooting in Pattern Plating Copper |
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| Yin Chunxi.Common Defects Troubleshooting in Pattern Plating Copper[J].Printed Circuit Information,2004(2):51-54. |
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| Authors: | Yin Chunxi |
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| Abstract: | The paper mainly introduces pattern plating defects of the PCB production and the causes of thesedefects. So we can find the factor that affects the production quality and make some prevention to improve the qualityin the PCB production. |
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| Keywords: | pattern plating common defects troubleshooting |
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