浅谈电极对平行缝焊质量的影响

伴随着现代微电子技术的高速发展,对温度较敏感的电子元器件在设计中被普遍采用,为了满足这种电子元器件的封装要求,平行缝焊技术应运而生。平行缝焊是一种温升小、气密性高的高可靠性封装方式,普遍用于对水汽含量和气密性要求较高的集成电路封装中。影响平行缝焊质量的有诸多因素,如盖板和管壳之间的匹配、工艺参数的设置、电极表面的状态等。我们通过在SSEC(Solid State Equipment Company)M-2300型平行缝焊机上进行实验,总结出电极的状态对于平行缝焊的成品率有着直接的影响。

The Influence of the Electrode on the Quality of the Parallel Seam Welding

With the fast development of the microelectronics technology,the temperature sensitive circuit elements are used in many fields of the designation widely.In order to satisfying the demand of packaging of the temperature sensitive circuit elements,the parallel seam welding technology has been devised.The parallel seam welding is the way of packaging that has some characteristics,including low temperature and high air tightness.The parallel seam welding technology is widely used in the IC packaging which has ...