| Preparation of salt-based colloid palladium of high concentration |
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| 引用本文： | 郑雅杰 肖发新 易丹青 龚竹青 李新海. Preparation of salt-based colloid palladium of high concentration[J]. 中国有色金属学会会刊, 2005, 15(1): 190-194 |
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| 作者姓名： | 郑雅杰 肖发新 易丹青 龚竹青 李新海 |
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| 作者单位： | [1]SchoolofMetallurgicalScienceandEngineering,CentralSouthUniversity,Changsha410083,China [2]SchoolofMaterialsScienceandEngineering,CentralSouthUniversity,Changsha410083,China |
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| 基金项目： | Project supported by Hubei Daye Nonferrous Metal Corporation of China |
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| 摘 要： | A kind of salt-based colloid palladium of high concentration was prepared, with concentration up to 3.6g/L on amount of PdCl2. The optimal preparation conditions of the salt-based colloid palladium were that the PdCl2 and NaCl concentrations were respectively 3.6 g/L and 175 g/L, mole ratio of Sn to Pd was 50:1, reaction temperature was 20 -35℃, with urea, ascorbic acid and vanillin added in a proper amount. The test results of optimal condition show that the time of starting hydrogen-deposition is 9 s, the time of completely coating copper on a test substrate is 2 min, the stability time of colloid palladium is 98 h after it is diluted into 0. 1 g/L(on amount of PdCl2)when the solution temperature is 20 *C, the backlight lever of electroless copper plating layer is 10th grade of 10 grade system, the adhesion force of the copper layer is up to GB5270--85 of China, and the average particle size of the colloid palladium is 81 nm measured by Master Sizer.
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| 关 键 词： | 盐基钯胶子 稳定性 化学镀层 浓度活性 |
Preparation of salt-based colloid palladium of high concentration |
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| ZHENG Ya-jie,XIAO Fa-xin,YI Dan-qing,GONG Zhu-qing,LI Xin-hai. Preparation of salt-based colloid palladium of high concentration[J]. Transactions of Nonferrous Metals Society of China, 2005, 15(1): 190-194 |
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| Authors: | ZHENG Ya-jie XIAO Fa-xin YI Dan-qing GONG Zhu-qing LI Xin-hai |
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| Abstract: | A kind of salt-based colloid palladium of high concentration was prepared,with concentration up to 3.6g/L on amount of PdCl2.The optimal preparation conditions of the salt-based colloid palladium were that the PdCl2and NaGl concentrations were respectively 3.6g/L and 175g/L,mole ratio of Sn to Pd was 50:1,reaction temperature was 20-35 ℃,with urea,ascorbic acid and vanillin added in a proper amount.The test results of optimal condition show that the time of starting hydrogen-deposition is 9 s,the time of completely coating copper on a test substrate is 2 min,the stability time of colloid palladium is 98 h after it is diluted into 0.1g/L(on amount of PdCl2)when the solution temperature is 20 ℃,the backlight lever of electroless copper plating layer is 10th grade of 10-grade system,the adhesion force of the copper layer is up to GB5270-85 of China,and the average particle size of the colloid palladium is 81 nm measured by Master Sizer. |
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| Keywords: | salt-based colloid palladium preparation activation stability |
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