| 电子设备热设计的最近发展 |
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| 引用本文： | 周绪康.电子设备热设计的最近发展[J].桂林电子科技大学学报,1989(1). |
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| 作者姓名： | 周绪康 |
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| 作者单位： | 桂林电子工业学院电子机械系 |
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| 摘 要： | 近年来,由于电子设备器件的发展,功率密度的迅速提高;电子设备的“短、小、轻、薄”化;电子组装技术从插入安装技术(IMT)向表面安装技术(SMT)发展,印刷线路板(PCB)电子机箱和印刷线路板的散热已成为当前热设计的重要课题,本文就此对国外发展近况作一简要介绍。
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| 关 键 词： | 印刷线路板 功率密度 强迫空冷 自然空冷 辐射冷却 温升 |
The Recent Developments for Thermal Design of Electronic Equipments |
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| Zhou Xiukang.The Recent Developments for Thermal Design of Electronic Equipments[J].Journal of Guilin Institute of Electronic Technology,1989(1). |
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| Authors: | Zhou Xiukang |
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| Affiliation: | Zhou Xiukang |
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| Abstract: | Of late years, as the electronic equipments have got shorter smaller, lighter and thiner; the assembly technique has developed from IMT (Insertion Mounting Technique) into SMT (Surface Mounting Technique) and the power density of the equipment has been on the increase with all speed, the heat dissipation for the printed circuit boards and for the case in which some boards are involved becomes an important problem at present. In the paper, the recent external developments are introduced in brief. |
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| Keywords: | thermal design PCB(Printed Circuit Board) power density forced air cooling natural air cooling radiation cooling temperature rise |
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