钎剂中活化组分对微连接电路腐蚀性的影响

通过制备不同活化剂的松香型钎剂，采用Sn-0．7Cu无铅钎料模拟微连接电路钎焊，利用加速腐蚀实验，研究不同类型、不同含量的活化剂对微连接电路腐蚀性的影响规律。结果表明，含不同活性剂的钎剂残留物的腐蚀性由大到小依次为：盐酸二甲胺、二乙胺盐酸盐、戊二酸、柠檬酸、三乙醇胺、草酸、DL-苹果酸、硬脂酸、月桂酸、丁二酸；添加二乙胺盐酸盐的松香钎剂的扩展率最大，添加柠檬酸的最小，二乙胺盐酸盐的腐蚀性明显强于柠檬酸。

Effects of Different Activators in the Flux on the Corrosivity of Lead-free Electronic Micro Joining Circuit

Through the preparation of rosin-based flux with different activators, and simulation of micro joint connection with Sn-0.7Cu lead free solder, by use of accelerated corrosion test, the effects of different types and different levels of the activators on the corrosion in PCBs are studied. The results show that the corrosivity descending order of flux residues with dif- ferent active agents is as follows., dimethylamine hydrochloride, diethylamine hydrochloride,glutaric acid,citric acid, triethanolamine,oxalate, DL-malic acid , hard fatty acid,lauric acid, succinic acid, the expansion rate of rosin flux with added diethylamine hydrochloride is largest and that of citric acid is smallest, the corrosivity of diethylamine hydrochloride is stronger than citric acid.