| 细间距漏印模板与焊膏 |
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| 引用本文： | 曹继汉. 细间距漏印模板与焊膏[J]. 电子工艺技术, 1997, 18(1): 22-25 |
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| 作者姓名： | 曹继汉 |
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| 作者单位： | 长岭（集团）股份公司 |
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| 摘 要： | 在总结本厂苛产品试制工艺的基础上，就细间距的焊膏漏印模板的几种加工方法，模板开口模板开口侧壁的形状与要求进行了比较与说明，同时就细间距技术对焊膏的内在质量要求和工艺性要求进行了概述和总结。
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| 关 键 词： | 细间距器件 焊膏 漏印模板 焊料球 印制板 |
Fine-Pitch Printing Stencil and Solder Paste |
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| Cao Jihan. Fine-Pitch Printing Stencil and Solder Paste[J]. Electronics Process Technology, 1997, 18(1): 22-25 |
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| Authors: | Cao Jihan |
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| Abstract: | This paper makes comparison and explanation on processing methods of solder paste printing stencil,stencil aperture,requirements and shapes of stencil aperture wall for fine pitch technology based on the generaligation of the pilot process of a specific product in our company.The paper also summariges the requirements on fine-pitch solder paste inherent quality and paste process features. |
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| Keywords: | Fine pitch devices Solder paste pritting stencil Fine pitch solder paste Solder ball |
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