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双谱分析在铣刀状态监测中的应用
引用本文:胡友民,李锡文,杜润生,杨叔子.双谱分析在铣刀状态监测中的应用[J].振动.测试与诊断,2002,22(4):254-259.
作者姓名:胡友民  李锡文  杜润生  杨叔子
作者单位:华中科技大学机械电子信息工程系,武汉,430074
基金项目:国家自然科学基金资助项目 (编号 :5 9990 4 70 - 1)
摘    要:针对铣刀渐进磨损过程中主轴端振动加速度信号的非平稳时变特点,提出了基于双谱分析的铣刀状态监测信号特征抽取方法,分析了铣刀在正常磨损、急剧磨损、崩刃和破损条件下,主轴端振动加速度信号的双谱特点,通过实验研究,在立式加工中心上验证了上述方法的有效生,研究表明双谱分析方法较其它方法更加适宜铣刀状态监测。

关 键 词:立铣刀  状态监测  振动加速度  双谱分析
修稿时间:2002年5月13日

Application of Bispectrum Analysis to Helical Cutter Condition Monitoring
Hu Youmin,Li Xiwen,Du Runsheng,Yang Shuzi.Application of Bispectrum Analysis to Helical Cutter Condition Monitoring[J].Journal of Vibration,Measurement & Diagnosis,2002,22(4):254-259.
Authors:Hu Youmin  Li Xiwen  Du Runsheng  Yang Shuzi
Abstract:In milling process, the producing quality is affected by cutter wear condition. The condition can be monitored by spindle vibration accelerations. In accordance with the nonstationarity of the acceleration due to the progressive wear of the cutter, a method for extracting the cutter wearing feature by bispectrum analysis is presented. The characteristics of the bispectra of different wear stages, including initial wear stage, normal wear stage and rapid wear stage are analyzed. Experimental results show that the method is effective and more suitable for milling cutter condition monitoring than the others.
Keywords:helical cutter  condition monitoring  vibration acceleration  bispectrum
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