| 硅-玻璃-硅阳极键合机理及力学性能 |
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| 引用本文： | 陈大明, 胡利方, 时方荣, 孟庆森. 硅-玻璃-硅阳极键合机理及力学性能[J]. 焊接学报, 2019, 40(2): 123-127. DOI: 10.12073/j.hjxb.2019400054 |
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| 作者姓名： | 陈大明 胡利方 时方荣 孟庆森 |
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| 作者单位： | 太原理工大学 新材料界面科学与工程教育部重点实验室,太原,030024;太原理工大学 新材料界面科学与工程教育部重点实验室,太原 030024;太原理工大学 先进镁基材料山西省重点实验室,太原 030024 |
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| 基金项目： | 国家自然科学基金资助项目(51405328) |
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| 摘 要： | 采用两步法阳极键合技术成功实现了硅-玻璃-硅的连接. 两次键合过程中，电流特征有明显差异，第一次键合电流先迅速增大到峰值电流，然后迅速衰减至一较小值. 受先形成Na+离子耗尽层的影响，第二次键合电流从峰值电流衰减的过程中，出现二次增大然后衰减的现象. 利用扫描电镜对键合界面进行观察，结果表明玻璃两侧界面均键合良好，玻璃表面可观察到大量析出物. 利用万能材料试验机对键合强度进行测试，结果表明，界面强度随着键合电压的升高而增大. 断裂主要发生在玻璃基体内部靠近第二次键合界面一侧.
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| 关 键 词： | 阳极键合 硅-玻璃-硅 电子封装 键合强度 |
| 收稿时间： | 2017-10-08 |
Mechanism and mechanical property of Si-glass-Si anodic bonding process |
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| CHEN Daming, HU Lifang, SHI Fangrong, MENG Qinsen. Mechanism and mechanical property of Si-glass-Si anodic bonding process[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2019, 40(2): 123-127. DOI: 10.12073/j.hjxb.2019400054 |
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| Authors: | CHEN Daming HU Lifang SHI Fangrong MENG Qinsen |
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| Affiliation: | 1. Department of Materials Science and Engineering, Taiyuan University of Technology, Taiyuan 030024, China;2. Shanxi Key Laboratory of Advanced Magnesium-based Materials, Taiyuan University of Technology, Taiyuan 030024, China |
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| Abstract: | Si-glass-Si was successfully bonded together through a two-step anodic bonding process. The bonding current in each step of the two-step bonding process was investigated, and found to be quite different. The first bonding current decreased quickly to a relatively small value. But for the second bonding step, there were two current peaks, the current varified as decrease-increase-decreased rule. SEM was conducted to investigate the interfacial structure of the Si-glass-Si samples. Tensile tests indicated that the fracture occurred at the glass substrate and bonding strength increased with the increment of the bonding voltage. |
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| Keywords: | anodic bonding|Si-glass-Si|electronic packaging|bonding strength |
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