基于ICEPAK仿真的散热器结构热设计研究

文中利用ICEPAK软件对多密度高功率芯片散热器结构进行了热设计研究。研究确立了影响翅片散热器散热性能的关键尺寸设计参数，如基板厚度、翅片高度、翅片厚度和翅片间距等，并得出了各尺寸设计参数对其散热效果的影响趋势，确定了散热器结构的最佳布局方案。此外，研究还建立了最佳布局的散热器结构实物并进行了高低温试验以模拟其高温散热情况。通过实验数据对比发现，仿真计算结果与实际较为吻合，进而验证了ICEPAK软件在电子设备散热设计方面的准确性与可靠性。

Thermal Design of Heat Sink Structure Based on ICEPAK Simulation

The thermal design of heat sink structure for multi-density and high-power chip is studied by ICEPAK software in this paper. The key dimension design parameters which affect the heat dissipation performance of heat sink, such as the base plate thickness, the fin height, the fin thickness and the fin spacing, are established, the effect trend of heat sink dimension design parameters on its heat dissipation is obtained and the optimal structure layout of the heat sink is determined. In addition, the optimal layout of heat sink structure is established and high and low temperature experiments are carried out to simulate its high temperature heat dissipation in the study. By comparing with experimental data, it is found that the simulation results are in good agreement with the practice, which further validates the accuracy and reliability of ICEPAK software in the heat dissipation design of electronic equipment.