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钯含量对Ag-Cu-Pd钎料合金组织和性能的影响
引用本文:郭菲菲,陈晓宇,史秀梅,齐岳峰,张国清,黄晓猛,祁宇. 钯含量对Ag-Cu-Pd钎料合金组织和性能的影响[J]. 有色金属科学与工程, 2017, 8(3): 64-68. DOI: 10.13264/j.cnki.ysjskx.2017.03.010
作者姓名:郭菲菲  陈晓宇  史秀梅  齐岳峰  张国清  黄晓猛  祁宇
作者单位:1.北京有色金属与稀土应用研究所,北京 100012
基金项目:北京市人才培养资助项目(2013年)
摘    要:通过差热分析、扫描电镜显微组织分析、真空钎焊等手段,对不同Pd含量Ag-Cu-Pd钎料的熔化特性以及在无氧铜和镍上铺展性进行研究,并对铸态组织和钎焊界面组织进行分析.结果表明,随着Pd含量增加,Ag-Cu-Pd钎料的固相线温度、液相线温度有明显提高,固液相线温度间隔也随之增大;当Pd含量为10 %和20 %时钎料铺展性良好,且随着Pd含量增加,钎料合金铺展性降低,但当Pd增加到30 %时,钎料铺展性变差且有轻微侵蚀迹象;铸态Ag-Cu-Pd合金中Pd元素主要存在于富铜相中;Ag-28Cu-20Pd钎料焊接无氧铜板时的钎焊界面,形成连续的金属间化合物(IMC)层,钎料中Pd元素主要分布在IMC层上. 

关 键 词:Ag-Cu-Pd合金   熔化特性   铺展性   钎焊界面   金属间化合物层
收稿时间:2017-03-23

Effect of Pd content on microstructure and properties of Ag-Cu-Pd solder
Affiliation:1.Beijing Non-ferrous Metals and Rare Earth Research Institute, Beijing 100012, China2.Beijing Engineering Research Center of New Brazing Materials for Electronic Information, Beijing 100012, China
Abstract:The effects of Pd content on the melting properties, spreading properties on oxygen-free copper and nickel, as-cast organization of Ag-Cu-Pd solder, and brazing interface were studied. The results show that the solidus temperature and the liquidus temperature of Ag-Cu-Pd solder are obviously improved with the increase of Pd content. Accordingly, the temperature interval of solid-liquid phase line also increases. When Pd is 10 % and 20 %, the solder spreadability is optimal. In addition, the spreadability of solder alloy is reduced with the rising Pd content. When Pd is increased to 30 %, solder spreadability begins to deteriorate and there are signs of slight erosion. The Pd in Ag-Cu-Pd alloy is mainly present in the Cu-rich phase. The brazing interface forms a continuous intermetallic compound (IMC) layer when Ag-28Cu-20Pd solder is welded to the oxygen-free copper plate, with most of Pd distributing in IMC layer. 
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