| TiAl/Ti/GH99扩散连接接头应力的数值模拟 |
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| 引用本文： | 李海新,林铁松,何鹏,冯吉才. TiAl/Ti/GH99扩散连接接头应力的数值模拟[J]. 焊接学报, 2013, 0(8): 38-42 |
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| 作者姓名： | 李海新 林铁松 何鹏 冯吉才 |
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| 作者单位： | 哈尔滨工业大学先进焊接与连接国家重点实验室;山东省科学院海洋仪器仪表研究所 |
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| 基金项目： | 国家自然科学基金资助项目(50975062,51105107,51021002,51275135);黑龙江省自然科学基金资助项目(QC2011C044);中央高校基本科研业务费专项资金资助(HIT.BRET1.2010006,HIT.NSRIF.2010119,HIT.NSRIF.201135);高等学校博士学科点专项科研基金优先发展领域课题资助项目(20112302130005) |
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| 摘 要： | 利用有限元方法,对采用钛作中间层扩散连接TiAl基合金与GH99合金所得接头在冷却过程中所产生的应力分布情况进行分析,并研究了连接温度对应力分布特征及大小的影响.结果表明,在钛中间层与TiAl基合金和GH99合金的连接界面处均存在一定的应力集中,其中钛中间层与GH99合金的连接界面处应力相对较大.降低连接温度时,接头应力分布特征基本没有变化,但最大应力的数值随之减小.将模拟结果与试验结果进行对比发现,模拟结果与试验结果具有很好的吻合性.
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| 关 键 词： | 钛铝基合金 镍基高温合金 扩散连接 数值模拟 |
| 收稿时间： | 2012-06-15 |
Numerical simulation of residual stress in diffusion bonded TiAl/Ti/GH99 alloy joint |
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| LI Haixin,LIN Tiesong,HE Peng and FENG Jicai. Numerical simulation of residual stress in diffusion bonded TiAl/Ti/GH99 alloy joint[J]. Transactions of The China Welding Institution, 2013, 0(8): 38-42 |
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| Authors: | LI Haixin LIN Tiesong HE Peng FENG Jicai |
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| Affiliation: | 1(1.State Key Laboratory of Advanced Welding and Joining,Harbin institute of Technology,Harbin 150001,China;2.Shandong Provincial Key Laboratory of Special Welding Technology,Institute of Oceanographic Instrumentation,Shandong Academy of Sciences,Qingdao 266001,China). |
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| Abstract: | Finite element method was used to calculate the residual stress that developed during cooling from joining temperature while diffusion bonding TiAl-based intermetallics to Ni-based alloy with Ti interlayer. The effect of bonding temperature on the distribution of stress and joint size was investigated. The results show that the residual stress concentrated at the interfaces of Ti/GH99 and Ti/TiAl. Especially,the maximum residual stress was higher at the Ti/GH99 interface than at the Ti/TiAl interface. When the bonding temperature decreased,the distribution of stress in the joint was almost constant,while the maximum residual stress decreased. By comparing the simulated and experimental results,it was found that the simulated results agreed well with the experimental results. |
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| Keywords: | TiAl-based alloy Ni-based alloy diffusion bonding numerical simulation |
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