Improving Bonding to Piezoelectric Poly(vinylidene fluoride) for Sensor Applications |
| |
| Authors: | G. L. Anderson D. A. Dillard J. P. Wightman |
| |
| Affiliation: | a Department of Engineering Science and Mechanics, Virginia Polytechnic Institute and State University, Blacksburg, VA, U.S.A.b Thiokol Corporation, Advanced Technology, Brigham City, UT, U.S.A.c Department of Chemistry, Virginia Polytechnic Institute and State University, Blacksburg, VA, U.S.A. |
| |
| Abstract: | Argon, oxygen, nitrogen and ammonia plasmas and an acid etch pretreatment were performed on uniaxially stretched piezoelectric poly(vinylidene fluoride) film in order to improve wettability and bonding. Oxygen plasma was found to be too harsh, but nitrogen and argon plasmas improved wettability and resulted in a seven-fold increase in 180° peel strengths. However, this improvement in peel strength was accompanied by a 90% decrease in the piezoelectric properties of the polymer. The acid etch yielded contact angles similar to those of the plasma treated material, and improved peel strengths some twelve times over that of the untreated film. Significantly, no piezoelectric loss resulted from the acid etch. |
| |
| Keywords: | poly(vinylidene fluoride) wettability plasma pretreatment failure loci polymer acid etch piezoelectric polymers peel strength XPS analysis contact angle strain energy release rates |
| 本文献已被 InformaWorld 等数据库收录！ |
|
