Electrostatic deposition of silica nanoparticles between E‐glass fibers and an epoxy resin |
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Authors: | Benjamin H. Rutz John C. Berg |
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Affiliation: | Department of Chemical Engineering, Box 351750, University of Washington, Seattle, Washington |
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Abstract: | The achievement of optimum adhesion between a thermoset and an inorganic material is an important goal for the composites and coatings industries. There is a growing interest in the use of structural surface modifiers, such as nanotubes, nanoparticles, and whiskers, to improve this adhesion. Here, a method for electrostatically depositing poly(ethylene imine)‐functionalized silica nanoparticles onto E‐glass fibers was developed. The deposition of 26‐nm functionalized particles onto glycidyloxypropyltrimethoxysilane (GPS)‐functionalized E‐glass fibers and then their embedding in a resin of diglycidyl ether of bisphenol A and m‐phenylene diamine increased the interfacial shear strength (IFSS) 35% over that of bare fibers and 8% over that of GPS‐functionalized fibers. IFSS was highly dependent on the particle size; the 16‐nm functionalized particles had little effect on the IFSS. When the particles size was increased to 71 and 100 nm, this led to increasingly poor IFSS values, whereas the 26‐nm particles produced the best results. Similar results were seen with the transverse flexural strength of the unidirectional composites. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 41516. |
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Keywords: | colloids composites mechanical properties self‐assembly |
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